Sorry - I disagree. You've never had anything electronic act up (without abusing it)?
Again, based on the products my company sells, HW faults do occur. Bad parts from the factory, ESD damage, bad solder joint, tin whiskers (if lead free solder, and most new components now come pre-tinned with lead free solder now), and even SEU can cause a HW fault. And the list of possible failure modes/causes is a LOT longer. Our production test and environmental stress screening catches most before shipping, but we get a fair stream of field returns. And again, our vendors do not do the same level of analysis/testing.
I do think one point to consider - look at other consumer electronics; cell phone, TV, PC. Those are powered on and used multiple hours a day (if not 24/7).
Compared to that, our electronics are powered on and used for typically an hour or two (depends on how quickly the range is loading/launching) once every few weeks/months/years? So the probability of failure compared to power on time is very low, but not zero.
I also can't recall ever seeing anyone prepping their rocket on the field using an ESD strap. How many use a properly grounded strap (and ESD protected work surface) when building their sled? ESD damage alone can be a significant cause of an unexpected HW fault....
It is all going to come down to personal preference and risk an individual is willing to accept, plus accepting the risk they place on others attending and on rocketry in general. I've had a big rocket (not mine) come in ballistic and crash less than 50' from me. It was interesting feeling the shock wave through the ground. Not certain what the cause was - the rocket was fairly buried in the ground. But if a rocket causes significant damage (hit a car) or worse (hit a person) because "redundancy is not worth while", well......
There are ways to ameliorate ESD problems, which, I have found are the worst when the air is cold and dry, and everyone is wearing nylon filled with goosedown.
I learned suddenly and indeliably on a service trip as I touched an equipment rack, and it dropped me like 440, lol.
I've never been hit that hard. I turned to the other guy, and said "Foundit!"lets get the hell out of here!"
We built a computer-based leak detection equipment, and it was locking up. Hell, it about locked ME up.
Esd is easier to deal with now than it was 20 years ago; look into x2y caps, a tiny one on every lead that goes to a connector, series resistors, inductors if resistors wont work, large ground planes all the way to the edge of the board, with a low ac impedance across the voltage plane is will give time for the on chip protection turn on, and keep the chips from being damaged. underfill makes rework hard, but it increases the g tolerance considerably.
Acrylic humaseal is reworkable, and protects against most physical damage.
Also, a production tip I learned 30 years ago:if you take your new production, test power-on, and if functional, leave powered on for 48 hours, at 80C. Don't leave them running a loop, just powered on.
If they passed testingafter that then we knew they were into the 'bathtub', and not on the edge. "bathtub curve" is a reliability curve. leading edge is the infant mortality, other edge is wear out.
Don't get me started on halt/hass.