itisyeetimetoday
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I'm attempting to make circuit boards using fiberglass impregnated with epoxy resin. In order to save on material cost, I decided to use US Composites 635 Thin Epoxy Resin that I use for wet layups. Unfortunately, plating copper onto the fiberglass boards requires a bath at 60C degrees, and given the warping of the board in the bath, I'm guessing that's far beyond the glass transition temperature of the epoxy.
That being said, US Composites doesn't seem to publish post curing schedule, and after emailing a rep, they said that even with a post cure of 2 hours at 250F, the heat distortion temperature of my slow hardener is only 46-52C.
Has anyone tried post curing US Composites, and had any success with increasing the glass transition temperature and heat resistance of the epoxy?
That being said, US Composites doesn't seem to publish post curing schedule, and after emailing a rep, they said that even with a post cure of 2 hours at 250F, the heat distortion temperature of my slow hardener is only 46-52C.
Has anyone tried post curing US Composites, and had any success with increasing the glass transition temperature and heat resistance of the epoxy?